Semiconductor Process Molds
Semiconductor Process Molds
Semiconductor precision molds incl. Moving Cavity Block & TUBE Plate
Key Engineering Features
Manufactures cavity blocks (Moving Cavity, Upper Main, Upper Gate Block) for semiconductor EMC molding, plus TUBE Plate dies and Oil Cooler components. Stable dimensional accuracy under temperature variation through thermal expansion control design.
Full lineup of Moving Cavity, Upper Main & Upper Gate Blocks for EMC molding
Semiconductor precision molds incl. Moving Cavity Block & TUBE Plate
TUBE Plate dies and precision Oil Cooler components
Semiconductor precision molds incl. Moving Cavity Block & TUBE Plate
CTE-controlled material design ensures dimensional stability in high-temperature processes
Semiconductor precision molds incl. Moving Cavity Block & TUBE Plate
The Engineering Advantage
Manufactures cavity blocks (Moving Cavity, Upper Main, Upper Gate Block) for semiconductor EMC molding, plus TUBE Plate dies and Oil Cooler components. Stable dimensional accuracy under temperature variation through thermal expansion control design.
Technical Specifications
Semiconductor Process Molds — Semiconductor
Moving Cavity Block
Semiconductor Mold Main Part
| Usage | Core block that forms the resin cavity in semiconductor package EMC molding process |
|---|---|
| Tolerance | ±0.002mm |
| Lead Time | 16 weeks after order |
| Process | 설계→소재 입고→정밀 MC 가공→방전 가공→정밀 연삭→검사/TEST→납품 |
Upper Main Block
For Chip Encapsulation
| Usage | Main block mounted on the upper part of EMC molding equipment to form the cavity |
|---|---|
| Tolerance | ±0.002mm |
| Lead Time | 16 weeks after order |
| Process | 설계→소재 입고→정밀 MC 가공→방전 가공→정밀 연삭→검사/TEST→납품 |
Upper Gate Block
Resin Injection Gate
| Usage | Block that forms the gate shape for injecting EMC resin into the cavity |
|---|---|
| Tolerance | ±0.003mm |
| Lead Time | 14 weeks after order |
| Process | 설계→소재 입고→정밀 MC 가공→방전 가공→정밀 연삭→검사/TEST→납품 |
TUBE Plate Die
For Oil Cooler
| Usage | Die for forming the internal TUBE of Oil Cooler to precise shape |
|---|---|
| Tolerance | ±0.005mm |
| Lead Time | 12 weeks after order |
| Process | 설계→소재 입고→NC 가공→정밀 연삭→조립→검사/TEST→납품 |
Oil Cooler Component
TUBE Plate based
| Usage | Precision Oil Cooler component for thermal management of semiconductor process equipment |
|---|---|
| Tolerance | ±0.005mm |
| Lead Time | 10 weeks after order |
| Process | Design→Material Receipt→NC Machining→Assembly→Inspection/Test→Delivery |
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